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【STATSChP S24 交流专区】新科金朋 STATS CHIPPAC LTD
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STATS ChipPAC Ltd. (“STATS ChipPAC” or “the Company” - SGX-ST: STATSChP) is a leading provider of advanced semiconductor packaging and test services. STATS ChipPAC’s full turnkey semiconductor solutions include package design, bump, probe, assembly, test and distribution services. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the communication, consumer and computing markets.
With a strong technology portfolio ranging from flip chip, wafer level and advanced 3D packages to leadframe and laminate based packages, STATS ChipPAC provides customers with innovative and cost-effective semiconductor solutions. We have a leadership position in advanced packaging technology including fan-in and fan-out wafer level packaging, flip chip interconnect, 3D integration and Through Silicon Via (“TSV”) to meet the increasing market demand for next-generation electronic devices with higher levels of integration, increased functionality and compact sizes. We provide wafer probe and final testing on a diverse selection of test platforms, with expertise in testing a broad variety of semiconductors for mixed-signal, radio frequency, analog and high-performance digital devices.
With corporate headquarters in Singapore, our global manufacturing facilities are strategically located in South Korea, Singapore, China, Malaysia and Taiwan (which includes our 52%-owned subsidiary, STATS ChipPAC Taiwan Semiconductor Corporation). We market our services through our direct sales force in the United States, South Korea, Japan, China, Singapore, Malaysia, Taiwan and Switzerland. With an established presence in the countries where strategic semiconductor markets are located, we are in close proximity to the major hubs of semiconductor manufacturing which allows us to provide customers with fully-integrated, multi-site, end-to-end packaging and test services.
STATS ChipPAC is listed on the Singapore Exchange Securities Trading Limited (SGX-ST).
公司官网：http://www.statschippac.com/
| Name of Announcer * | STATS CHIPPAC LTD | | Company Registration No. | 199407932D | | Announcement submitted on behalf of | STATS CHIPPAC LTD | | Announcement is submitted with respect to * | STATS CHIPPAC LTD | | Announcement is submitted by * | Tham Kah Locke | | Designation * | Vice President of Corporate Finance | | Date & Time of Broadcast | 13-Aug-2013 07:21:36 | | Announcement No. | 00009 |
| The details of the announcement start here ... |
| Announcement Title * | STATS ChipPAC and Nanyang Technological University Collaborate on New Innovative Packaging Technologies |
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楼主 |
发表于 26-8-2013 12:29 AM
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| Name of Announcer * | STATS CHIPPAC LTD | | Company Registration No. | 199407932D | | Announcement submitted on behalf of | STATS CHIPPAC LTD | | Announcement is submitted with respect to * | STATS CHIPPAC LTD | | Announcement is submitted by * | Tham Kah Locke | | Designation * | Vice President of Corporate Finance | | Date & Time of Broadcast | 20-Aug-2013 05:19:07 | | Announcement No. | 00001 |
| The details of the announcement start here ... |
| Announcement Title * | STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions with eWLB Packaging |
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楼主 |
发表于 13-5-2014 04:30 AM
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“苹果”会掉到新科金朋手中吗？
企业摘要 | 2014年04月11日
文 : 吴文青
http://www.sharesinv.com/zh/articles/46094/
在大约半年前，当苹果公司(Apple Corporation)推出iPhone 5S时，世界各地的忠实苹果手机用户都提早到苹果产品的专卖店或电讯公司门外排队，以在第一时间买到苹果推出的最新产品。
对一名忠实的苹果手机用户来说，如果有人要把他的手机里的零件拆出来，他应该会相当紧张吧！
如果我们把一台iPhone拆开，就会发现里头的各个零件，其实都是由不同公司生产的。
比方说，iPhone的“视网膜屏幕(Retina display)”是由日本的东芝(Toshiba)生产，其音效晶片的生产商则是美国的Cirrus Logic。
苹果指定的代工厂商富士康(Foxconn)负责装配这些零件，iPhone和iPad等产品就是由其人数达20万人的组装线生产。
因此，每台iPhone后面都会有“在中国组装(Assembled in China)”的字样。
那这与新科金朋(STATS ChipPAC)有什么关系呢？这就要从苹果和三星(Samsung)的关系说起。三星原本是负责为苹果生产晶片组的制造商，但由于这两家公司之后因为专利问题而打官司，苹果因此选择找其他厂家帮它生产晶片组。
据说，将在今年推出的iPhone 6所采用的“A8”晶片，其封装工作的订单已落入了三家公司手中，即艾克尔国际科技(Amkor Technology)、日月光半导体(Advanced Semiconductor Engineering)和新科金朋。
还有消息说，艾克尔国际科技和新科金朋各拿到了40%的订单。苹果在去年推出iPhone 5S后的首三个月内便卖出了将近1,000万台，预计将在今年推出的新款iPhone也将大卖，新科金朋将能从中受惠。
优点
- 公司若确实取得A8晶片的订单，将能大大受惠。
- 公司的财务状况良好，拥有充足现金，其流动比率为1.1，债务股本比为0.7。
投资风险
- 目前尚未确定公司是否取得来自苹果的订单。
- 苹果一向来都会压低供应商的价格，这可能会影响新科金朋的毛利率
- 公司的资本开支偏高，每年约为1亿2,000万元
《股市资讯》的看法
自有关公司取得苹果订单的消息传出以来，其股价上涨了将近14.5%。虽然其股价应已在一定程度上反映了此利好消息，但现在买入这只股或许还不算太迟。
假设苹果没有过度压低价格，新科金朋的盈利将会因为晶片订单而增加，其股价也将会随之上扬。
另外，苹果在选定供应商后一般不会更换，这将为新科金朋带来稳定的收入来源。 本帖最后由 icy97 于 13-5-2014 04:54 AM 编辑
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发表于 16-5-2014 04:54 PM
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新科金朋 昨日宣布有第3方提出意向收购所有新科金朋的股份。现在有传闻第3方可能是富士康。记得buy on rumours and sell on news! |
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发表于 19-5-2014 12:57 PM
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suntecinvestor 发表于 16-5-2014 04:54 PM 
新科金朋 昨日宣布有第3方提出意向收购所有新科金朋的股份。现在有传闻第3方可能是富士康。记得buy on rumo ...
今天在$0.51 和 $0.52 卖完上星期五买的票。净赚S$1,000+。 感恩新科金朋~！
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发表于 20-5-2014 09:23 AM
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suntecinvestor 发表于 19-5-2014 12:57 PM
今天在$0.51 和 $0.52 卖完上星期五买的票。净赚S$1,000+。 感恩新科金朋~！
准备在$0.48~$0.485买回。
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发表于 20-5-2014 10:37 AM
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成功买回！ |
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发表于 22-5-2014 03:37 PM
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suntecinvestor 发表于 20-5-2014 10:37 AM
成功买回！
遇到MKT MAKER 了... 有机会可以互相交流吗???
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发表于 29-5-2014 11:44 AM
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thsy1127 发表于 22-5-2014 03:37 PM
遇到MKT MAKER 了... 有机会可以互相交流吗???
你也是做股票的吗？ 有什么股票可以建议的？
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发表于 29-5-2014 03:13 PM
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发表于 29-5-2014 04:07 PM
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两个都没有。股价抬高了，完全不看着两支股。哈哈。 哈 |
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发表于 29-5-2014 06:29 PM
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管他好不好。。。这两只可以cover 一个月的屋期了。 还有那个SMRT 之前趁底捞进现在也是.gif) |
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发表于 12-6-2014 10:06 AM
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suntecinvestor 发表于 20-5-2014 10:37 AM
成功买回！
再次加码$0.655-$0.660
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发表于 12-6-2014 10:29 AM
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发表于 12-6-2014 11:20 AM
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woh~~ 暂停交易！！好消息来呀．ＨＵＡＴ ＡＨ～～！ |
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发表于 12-6-2014 01:41 PM
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suntecinvestor 发表于 12-6-2014 11:20 AM
woh~~ 暂停交易！！好消息来呀．ＨＵＡＴ ＡＨ～～！
股价直线而下，发生什么事啊？
不是有好消息咩？
大大卖了没？
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发表于 12-6-2014 02:10 PM
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llooll 发表于 12-6-2014 01:41 PM
股价直线而下，发生什么事啊？
不是有好消息咩？
之前有两个第３方表示有意收购ｓｔａｔｓｃｈｐｐａｃ． 其中一方已经放弃收购。另一个第３方还在讨论中。本人的价格在$0.480 and $0.655 (ave $0.5675)。刚开市的时候已经卖了一半在＄０．６３０  |
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发表于 12-6-2014 02:22 PM
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suntecinvestor 发表于 12-6-2014 02:10 PM
之前有两个第３方表示有意收购ｓｔａｔｓｃｈｐｐａｃ． 其中一方已经放弃收购。另一个第３方还在讨论中 ...
差不多要跌到你买的价位了，还不打算丢吗？
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发表于 12-6-2014 02:35 PM
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llooll 发表于 12-6-2014 02:22 PM
差不多要跌到你买的价位了，还不打算丢吗？
还有一方在进行商谈中．已经丢了一半，赚了１１％，另一半再看．反正是用ｃａｓｈ ｈｏｌｄ。会继续观察，情况不对，还是会卖。
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发表于 12-6-2014 11:11 PM
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