【TECHBND 5289 交流专区】

Tony-Pua

官网：http://www.techbond.com.my

Company/Fund Name	Adviser	Nature of Transaction	Last Date of Exposure	Exposure Period (working days)	Notes
Techbond Group Berhad	Public Investment Bank Berhad	IPO	17 April 2018	15	2

icy97

actura

看来好像可以投资。。

hatelee

下月5日登场·发售价66仙-德宝上市筹3967万
http://www.enanyang.my/news/20181113/下月5日登场·发售价66仙-德宝上市筹3967万/

IPO Prospectus

TECHBOND GROUP BERHAD

Subject

PUBLIC ISSUE OF 60,105,000 NEW ORDINARY SHARES IN TECHBOND GROUP BERHAD ("SHARES") AT AN ISSUE PRICE OF RM0.66 PER SHARE PAYABLE IN FULL UPON APPLICATION COMPRISING: (I)        11,500,000 NEW SHARES AVAILABLE FOR APPLICATION BY THE MALAYSIAN PUBLIC; (II)        6,000,000 NEW SHARES AVAILABLE FOR APPLICATION BY THE ELIGIBLE DIRECTORS AND EMPLOYEES OF OUR COMPANY AND OUR SUBSIDIARIES ("GROUP") AND OTHER PERSON(S) WHO HAVE CONTRIBUTED TO THE SUCCESS OF OUR GROUP; (III) 23,000,000 NEW SHARES AVAILABLE FOR APPLICATION BY WAY OF PRIVATE PLACEMENT TO BUMIPUTERA INVESTORS APPROVED BY THE MINISTRY OF INTERNATIONAL TRADE AND INDUSTRY, MALAYSIA; AND (IV)        19,605,000 NEW SHARES AVAILABLE FOR APPLICATION BY WAY OF PRIVATE PLACEMENT TO SELECTED INVESTORS, IN CONJUNCTION WITH OUR LISTING ON THE MAIN MARKET OF BURSA MALAYSIA SECURITIES BERHAD.

http://www.bursamalaysia.com/market/listed-companies/company-announcements/5972041

Attachments Techbond Group Berhad (Bursa) Part 1.pdf Techbond Group Berhad (Bursa) Part 2.pdf Detailed Procedures for Application and Acceptance.pdf

Opening of application	13 Nov 2018
Closing of application	23 Nov 2018
Balloting of application	27 Nov 2018
Allotment of IPO shares to successful applicants	03 Dec 2018
Tentative listing date	05 Dec 2018

icy97

粘合剂质量并重．德宝集团研发扩展版图
http://www.sinchew.com.my/node/1820315/

icy97

德宝集团新股超购24倍
http://www.enanyang.my/news/20181201/德宝集团新股超购24倍/

TECHBOND GROUP BERHAD INITIAL PUBLIC OFFERING ("IPO") IN CONJUNCTION WITH THE LISTING ON THE MAIN MARKET OF BURSA MALAYSIA SECURITIES BERHAD COMPRISING PUBLIC ISSUE OF 60,105,000 NEW ORDINARY SHARES AT AN ISSUE PRICE OF RM0.66 PER SHARE PAYABLE IN FULL UPON APPLICATION

Tricor Investor & Issuing House Services Sdn Bhd ("TIIH") wishes to announce that the IPO of Techbond Group Berhad ("Techbond") available for public subscription has been oversubcribed.

A total of 8,158 applications for 289,751,300 new shares with a value of RM191,235,858.00 were received from the Malaysian public for 11,500,000 new shares made available for public subcription, which represents an overall oversubscription rate of 24.20 times.

The notices of allotment will be despatched to all successful applicants on or before 4 December 2018.

http://www.bursamalaysia.com/market/listed-companies/company-announcements/5985585

Attachments PRESS RELEASE.pdf

icy97

SUMMARY OF KEY FINANCIAL INFORMATION 30 Sep 2018

		INDIVIDUAL PERIOD		CUMULATIVE PERIOD
		CURRENT YEAR QUARTER	PRECEDING YEAR CORRESPONDING QUARTER	CURRENT YEAR TO DATE	PRECEDING YEAR CORRESPONDING PERIOD
		30 Sep 2018	30 Sep 2017	30 Sep 2018	30 Sep 2017
		$$'000	$$'000	$$'000	$$'000

1	Revenue	23,221	0	23,221	0
2	Profit/(loss) before tax	5,059	0	5,059	0
3	Profit/(loss) for the period	3,883	0	3,883	0
4	Profit/(loss) attributable to ordinary equity holders of the parent	3,883	0	3,883	0
5	Basic earnings/(loss) per share (Subunit)	2.29	0.00	2.29	0.00
6	Proposed/Declared dividend per share (Subunit)	0.00	0.00	0.00	0.00
		AS AT END OF CURRENT QUARTER		AS AT PRECEDING FINANCIAL YEAR END
7	Net assets per share attributable to ordinary equity holders of the parent ($$)	0.5300		0.0000

icy97

Initial Public Offering

TECHBOND GROUP BERHAD

Date of Listing	05 Dec 2018
Enlarged Issued Share Capital in the following
Units	230,000,000
Currency	Malaysian Ringgit (MYR)
Par Value($$) (if applicable)
Enlarged Issued Share Capital ($$)	141,606,300.800
Stock Code	5289
Stock Name	TECHBND
ISIN code	MYL5289OO003
Board	Main Market
Bursa Sector	INDUSTRIAL PRODUCTS & SERVICES
Bursa Sub Sector	CHEMICALS

icy97

投资者追捧逆市而升-德宝首宗交易溢价22%
http://www.enanyang.my/news/20181206/投资者追捧逆市而升br-德宝首宗交易溢价22/

icy97

SUMMARY OF KEY FINANCIAL INFORMATION 31 Dec 2018

		INDIVIDUAL PERIOD		CUMULATIVE PERIOD
		CURRENT YEAR QUARTER	PRECEDING YEAR CORRESPONDING QUARTER	CURRENT YEAR TO DATE	PRECEDING YEAR CORRESPONDING PERIOD
		31 Dec 2018	31 Dec 2017	31 Dec 2018	31 Dec 2017
		$$'000	$$'000	$$'000	$$'000

1	Revenue	20,879	0	44,100	0
2	Profit/(loss) before tax	712	0	5,771	0
3	Profit/(loss) for the period	58	0	3,941	0
4	Profit/(loss) attributable to ordinary equity holders of the parent	58	0	3,941	0
5	Basic earnings/(loss) per share (Subunit)	0.03	0.00	3.34	0.00
6	Proposed/Declared dividend per share (Subunit)	0.00	0.00	0.00	0.00
		AS AT END OF CURRENT QUARTER		AS AT PRECEDING FINANCIAL YEAR END
7	Net assets per share attributable to ordinary equity holders of the parent ($$)	0.5500		0.0000

icy97

Date of change	25 Apr 2019
Name	MR LEE SEH MENG
Age	29
Gender	Male
Nationality	Malaysia
Designation	Alternate Director
Directorate	Executive
Type of change	Appointment

Qualifications

No	Qualifications	Major/Field of Study	Institute/University	Additional Information
1	Masters	Masters of Business (International Business)	University of Queensland, Australia
2	Degree	Bachelor Degree of Commerce (Accounting and Finance)	Monash University, Australia
3	Diploma	Diploma in Business (Commerce)	Monash College, Australia

Working experience and occupation	February 2011 to-dateSales Executive, Techbond Manufacturing Sdn BhdSeptember 2010 to January 2011Auditor, Eurogain Consulting Group Sdn BhdJanuary 2010 to August 2010Sales Executive, Royal Springs, Australia
Directorships in public companies and listed issuers (if any)	Nil
Family relationship with any director and/or major shareholder of the listed issuer	Son of Mr Lee Seng Thye (Managing Director) and Madam Tan Siew Geak (Executive Director).
Any conflict of interests that he/she has with the listed issuer	Nil
Details of any interest in the securities of the listed issuer or its subsidiaries	Techbond Group Berhad - 232,000 ordinary shares (Direct)

icy97

SUMMARY OF KEY FINANCIAL INFORMATION 31 Mar 2019

		INDIVIDUAL PERIOD		CUMULATIVE PERIOD
		CURRENT YEAR QUARTER	PRECEDING YEAR CORRESPONDING QUARTER	CURRENT YEAR TO DATE	PRECEDING YEAR CORRESPONDING PERIOD
		31 Mar 2019	31 Mar 2018	31 Mar 2019	31 Mar 2018
		$$'000	$$'000	$$'000	$$'000

1	Revenue	17,117	0	61,217	0
2	Profit/(loss) before tax	1,394	0	7,165	0
3	Profit/(loss) for the period	1,039	0	4,980	0
4	Profit/(loss) attributable to ordinary equity holders of the parent	1,039	0	4,980	0
5	Basic earnings/(loss) per share (Subunit)	0.45	0.00	3.21	0.00
6	Proposed/Declared dividend per share (Subunit)	0.00	0.00	0.00	0.00
		AS AT END OF CURRENT QUARTER		AS AT PRECEDING FINANCIAL YEAR END
7	Net assets per share attributable to ordinary equity holders of the parent ($$)	0.5600		0.0000

icy97

Date of change	15 May 2019
Name	MR LEE YUEN SHIUAN
Age	24
Gender	Male
Nationality	Malaysia
Designation	Alternate Director
Directorate	Executive
Type of change	Appointment

Qualifications

No	Qualifications	Major/Field of Study	Institute/University	Additional Information
1	Degree	Bachelor of Commerce, Major in Marketing and Management	The University of Melbourne
2	Diploma	Diploma in Business Studies	Monash College
3	Others	IGCSE Examination	Kolej Tuanku Ja'afar

Working experience and occupation	May 2017 - CurrentOperation Manager (Vietnam), Techbond Vietnam Co. LtdNovember 2016 to May 2017Business Development Executive, Techbond Manufacturing Sdn BhdMay 2016 to October 2016 Business Development Associate, Tetra Pak Malaysia Sdn Bhd March 2016 to May 2016Online Media Strategist, Locus-T Sdn Bhd
Directorships in public companies and listed issuers (if any)	Nil
Family relationship with any director and/or major shareholder of the listed issuer	Son of Mr Lee Seng Thye (Managing Director) and Madam Tan Siew Geak (Executive Director).
Any conflict of interests that he/she has with the listed issuer	Nil
Details of any interest in the securities of the listed issuer or its subsidiaries	Techbond Group Berhad - 232,000 ordinary shares (Direct)

icy97

Type	Announcement
Subject	OTHERS
Description	ACCEPTANCE OF CONTRACT FOR THE SUPPLY, CONSTRUCTION AND INSTALLATION OF THE FACTORY COMPLEX LOCATED AT NO. 18 VSIP II-A, STREET 23, VIETNAM-SINGAPORE INDUSTRIAL PARK II-A, VINH TAN COMMUNE, TAN UYEN TOWN, BINH DUONG PROVINCE, VIETNAM ("VSIP II") FOR AN APPROXIMATE CONTRACT SUM OF USD 2.7 MILLION ("AWARD OF CONTRACT")
Please refer to the attachment for details of the announcement. Please refer to the attachment below.

http://www.bursamalaysia.com/market/listed-companies/company-announcements/6168041

Attachments TGB_ Vietnam TMFG Contract USD 2.7M.pdf

icy97

SUMMARY OF KEY FINANCIAL INFORMATION 30 Jun 2019

		INDIVIDUAL PERIOD		CUMULATIVE PERIOD
		CURRENT YEAR QUARTER	PRECEDING YEAR CORRESPONDING QUARTER	CURRENT YEAR TO DATE	PRECEDING YEAR CORRESPONDING PERIOD
		30 Jun 2019	30 Jun 2018	30 Jun 2019	30 Jun 2018
		$$'000	$$'000	$$'000	$$'000

1	Revenue	20,162	0	81,379	0
2	Profit/(loss) before tax	2,993	0	10,158	0
3	Profit/(loss) for the period	2,093	0	7,073	0
4	Profit/(loss) attributable to ordinary equity holders of the parent	2,093	0	7,073	0
5	Basic earnings/(loss) per share (Subunit)	0.91	0.00	4.07	0.00
6	Proposed/Declared dividend per share (Subunit)	0.00	0.00	0.00	0.00
		AS AT END OF CURRENT QUARTER		AS AT PRECEDING FINANCIAL YEAR END
7	Net assets per share attributable to ordinary equity holders of the parent ($$)	0.5700		0.0000

icy97

TECHBOND GROUP BERHAD

EX-date	20 Sep 2019
Entitlement date	23 Sep 2019
Entitlement time	05:00 PM
Entitlement subject	Interim Dividend
Entitlement description	First Interim Single-Tier Dividend of 2 sen per share in respect of financial year ending 30 June 2020.
Period of interest payment	to
Financial Year End	30 Jun 2020
Share transfer book & register of members will be	to   closed from (both dates inclusive) for the purpose of determining the entitlement
Registrar or Service Provider name, address, telephone no	TRICOR INVESTOR & ISSUING HOUSE SERVICES SDN BHDUnit 32-01, Level 32, Tower A,Vertical Business Suite, Avenue 3, Bangsar South,No. 8, Jalan Kerinchi59200 Kuala LumpurTel:0327839299Fax:0327839222
Payment date	10 Oct 2019
a.Securities transferred into the Depositor's Securities Account before 4:30 pm in respect of transfers	23 Sep 2019
b.Securities deposited into the Depositor's Securities Account before 12:30 pm in respect of securities exempted from mandatory deposit
c. Securities bought on the Exchange on a cum entitlement basis according to the Rules of the Exchange.
Number of new shares/securities issued (units) (If applicable)
Entitlement indicator	Currency
Currency	Malaysian Ringgit (MYR)
Entitlement in Currency	0.02

icy97

SUMMARY OF KEY FINANCIAL INFORMATION 30 Sep 2019

		INDIVIDUAL PERIOD		CUMULATIVE PERIOD
		CURRENT YEAR QUARTER	PRECEDING YEAR CORRESPONDING QUARTER	CURRENT YEAR TO DATE	PRECEDING YEAR CORRESPONDING PERIOD
		30 Sep 2019	30 Sep 2018	30 Sep 2019	30 Sep 2018
		$$'000	$$'000	$$'000	$$'000

1	Revenue	19,377	23,221	19,377	23,221
2	Profit/(loss) before tax	3,553	5,059	3,553	5,059
3	Profit/(loss) for the period	2,708	3,883	2,708	3,883
4	Profit/(loss) attributable to ordinary equity holders of the parent	2,708	3,883	2,708	3,883
5	Basic earnings/(loss) per share (Subunit)	1.18	2.29	1.18	2.29
6	Proposed/Declared dividend per share (Subunit)	0.00	0.00	2.00	0.00
		AS AT END OF CURRENT QUARTER		AS AT PRECEDING FINANCIAL YEAR END
7	Net assets per share attributable to ordinary equity holders of the parent ($$)	0.5600		0.5700

icy97

TECHBOND GROUP BERHAD

Date of change	01 Dec 2019
Name	MR LEE SEH MENG
Age	30
Gender	Male
Nationality	Malaysia
Type of change	Redesignation
Previous Position	Alternate Director
New Position	Deputy Managing Director
Directorate	Executive

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Type	Announcement
Subject	NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) OTHER ISSUE OF SECURITIES
Description	TECHBOND GROUP BERHAD ("TECHBOND" OR THE "COMPANY")PROPOSED FREE WARRANTS ISSUE
On behalf of the Board of Directors of Techbond (“Board”), RHB Investment Bank Berhad wishes to announce that the Company proposes to undertake an issuance of up to 115,000,000 free warrants in Techbond (“Warrants”) on the basis of one (1) Warrant for every two (2) existing ordinary shares in Techbond held on an entitlement date to be determined by the Board and announced by the Company at a later date (“Proposed Free Warrants Issue”). Further details of the Proposed Free Warrants Issue are set out in the attachment below. This Announcement is dated 10 December 2019.

https://www.bursamalaysia.com/market_information/announcements/company_announcement/announcement_details?ann_id=3008723

Attachments Techbond Group Berhad - Announcement.pdf

icy97

TECHBOND GROUP BERHAD

Entitlement subject	Bonus Issue
Entitlement description	Issuance of up to 115,000,000 free warrants ("Warrants") in Techbond Group Berhad ("Techbond") on the basis of one (1) Warrant for every two (2) existing ordinary shares in Techbond held as at 5:00 p.m. on 20 February 2020
Shareholder's Approval	Yes
Ex-Date	19 Feb 2020
Entitlement date	20 Feb 2020
Entitlement time	5:00 PM
Financial Year End	30 Jun 2020
Share transfer book & register of members will be	to  closed from (both dates inclusive) for the purpose of determining the entitlement
Securities Crediting Date
a.Securities transferred into the Depositor's Securities Account before 4:30 pm in respect of transfers	20 Feb 2020
b.Securities deposited into the Depositor's Securities Account before 12:30 pm in respect of securities exempted from mandatory deposit
c. Securities bought on the Exchange on a cum entitlement basis according to the Rules of the Exchange.
Number of new shares/securities issued (units) (If applicable)	115,000,000
Entitlement indicator	Ratio
Par Value (if applicable)
Securities Entitlement
Company Name	TECHBOND GROUP BERHAD
Entitlement	Warrants
Ratio (New : Existing)	1.0000 : 2.0000
Available/Listing Date	02 Mar 2020